Duiven, the Netherlands, May 9, 2024 - BE Semiconductor Industries N.V. (the “Company" or "Besi") (Euronext Amsterdam: BESI; OTC markets: BESIY), a leading manufacturer of assembly equipment for the semiconductor industry, today announced the receipt of an order for 26 hybrid bonding systems from a leading semiconductor logic manufacturer. The order is for Besi’s latest generation system incorporating 100 nm placement accuracy and is scheduled for delivery in Q4-24 and Q1-25. Besi anticipates receiving additional hybrid bonding orders from other customers in Q2-24 as well.

Duiven, the Netherlands, April 25, 2024 - BE Semiconductor Industries N.V. (the "Company" or "Besi") (Euronext Amsterdam: BESI; OTC: BESIY), a leading manufacturer of assembly equipment for the semiconductor industry, today announced results of its Annual General Meeting of Shareholders (“AGM”).

Q1-24 Revenue of € 146.3 Million and Net Income of € 34.0 Million. Revenue Exceeds Midpoint of Guidance and Gross Margin above Guidance.

Duiven, the Netherlands, April 19, 2024 - BE Semiconductor Industries N.V. (“the Company” or "Besi"), (Euronext Amsterdam: BESI; OTC: BESIY), a leading manufacturer of assembly equipment for the semiconductor industry, will release its results for the first quarter ended March 31, 2024, on Thursday April 25, 2024 at 7.00 a.m. CET (1.00 a.m. EDT).

Q4-23 Revenue and Net Income of € 159.6 Million and € 54.9 Million, Up 15.9% and 36.6%, Respectively, vs. Q4-22. Results Exceed Prior Guidance. Orders of € 166.4 Million, Up 30.7% vs. Q3-23. FY-23 Revenue and Net Income of € 578.9 Million and € 177.1 Million, Respectively. Proposed Dividend of € 2.15 per Share for Fiscal 2023. 94% Pay-Out Ratio.